Zhonggui Semiconductor established in 2009, has grown from its roots in Yangzhou Zhongding Semiconductor Company to become a leader in the semiconductor industry. Leveraging technical innovation from the Nanos Institute of the Chinese Academy of Sciences, we specialize in the production and technological advancement of semiconductor silicon wafers. Our dedication has cultivated a distinguished technical team, securing our position as an industry leader.
We operate a class 100 cleanroom facility, equipped with slicing machines, grinding machines, beveling machines, chemical mechanical polishing machines, cutting machines, and more. We are dedicated to providing our customers with professional, customized services.
We have a global reach with our products being sold in multiple countries, including the United States, Russia, the United Kingdom, France, and so on. We are committed to collaborating with our clients to foster mutual development and achieve win-win partnerships.
With advanced equipment and a strong ISO 9001 quality management system, we ensure high-quality, tailored solutions for our clients.
Located in Yangzhou's Tianshan Town industrial zone, Silicore Technologies Ltd. is a direct source factory focused on delivering customized silicon-based products.
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The most popular form of solar wafers, Type A, has a purity level of 99.999 percent. It is used in smartphones, video recorders, and computer storage devices. It is also crucial in other devices requiring a high density and functionality.
Due to its high purity value, type B is more challenging to create than type A. However, it is employed in biosensors and high-quality colour hardware applications.
This wafer, a less expensive alternative to type B, has a purity of less than 99.999 percent. But, it satisfies the majority of uses. It is employed in the creation of logic chips. This solar wafer gives integrated circuits their power; thus, making it possible for computers and smartphones to transmit data and carry out operations.
For optical grading, polished Solar Wafer are often manufactured specifically. Solar Wafer are an ideal economical material for reflective optics and infrared (IR) applications. The FloatingZone or CZ manufacturing method is used to fabricate Solar Wafer for optical devices. This is because these methods produce fewer and higher defects than other methods. Used in micro-optical and fiber optic equipment worldwide. An obvious example is the image sensor (CIS) made from complementary metal-oxide semiconductor (CMOS) used in cameras.
Solar cells require Solar Wafer to increase efficiency and absorb more sunlight. Materials such as amorphous silicon, monocrystalline silicon and cadmium telluride are often used. Manufacturing processes such as the FloatingZone method can increase solar cell efficiency by nearly 25%. Just like microchips, solar cells follow a similar manufacturing process. The level of purity and quality required for solar cells is not as demanding as those used in computing and other electronics.
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Anti-Reflective Coating
An anti-reflective coating is applied to the front surface of the wafer. This coating helps minimize reflection losses and enhances light absorption into the solar cell. Common materials used for the coating include silicon nitride (SiNx) or titanium dioxide (TiO2). The coating is deposited using techniques like plasma-enhanced chemical vapor deposition (PECVD) or sputtering.
A thin layer of conductive material, usually a transparent conductive oxide (TCO) such as indium tin oxide (ITO) or fluorine-doped tin oxide (FTO), is deposited on the front surface of the wafer. This layer serves as the front contact, allowing the collection of charge carriers generated by incident light.
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P-N Junction Formation
● The solar wafer, typically made of p-type silicon, undergoes a diffusion process to create a p-n junction. Phosphorus or other n-type dopants are diffused into the front surface of the wafer, while boron or other p-type dopants are diffused into the back surface. This creates the necessary electric field within the wafer for charge separation.
To reduce surface recombination and enhance cell performance, a passivation layer is applied to the solar cell. This layer acts as a barrier, minimizing the loss of charge carriers at the surface. Common passivation materials include silicon nitride (SiNx) or aluminum oxide (Al2O3). The passivation layer is deposited using techniques like PECVD or atomic layer deposition (ALD).
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The manufactured solar cells undergo rigorous testing to ensure their performance and quality. Parameters such as efficiency, current-voltage characteristics, and electrical properties are measured to verify the functionality and adherence to specifications.
The manufacturing and production process of solar cells from a single crystal p-type silicon wafer has different patents and company trade processes, however, the steps below are the generalized method and process of most number of Silicon/Solar Wafer manufacturers.
Texturing- After the initial cleaning procedures, the wafer is being textured to create pyramid-like structures on the silicon surface. These pyramid-like structures made the incoming sunlight to reflect and bounce into other pyramids on the surface to improve the overall rate of sunlight absorption.
N doping (usually Phosphorous)- After texturing, a variety of methods are being utilized to dope the top surface of the p-type solar wafer to produce n-type regions. This process typically uses gas diffusion in a high-heat furnace, can create a critical p-n junction which will form as the permanent electrical grid.
Edge diffusion cleaning- The process of doping the surface of the solar wafer, causes the Phosphorous dopant to disperse to the wafer edges, and if the excess dopant remained it can cause short-circuits between the negative and positive contacts of the solar cell. So the excess dopant should be removed by an acid-etching procedure.
Anti-reflective coating- To improve its light absorption, the wafer will be coated by an anti-reflective coating which is usually a silicon nitride coating.
Screen printing of front and rear surface contacts-
Our specialization in custom-made silicon wafers, seed crystals, silicon targets, and spacers allows us to meet diverse needs across the semiconductor and solar industries. Our commitment to providing personalized services enables our clients to achieve their specific project goals with precision and efficiency.
